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用于先進(jìn)SiC功率模塊的整體解決（核心設(shè)備/材料/工程）方案Overall solution (core equipment/materials/engineering) for advanced SiC power module周鑫蘇州博湃半導(dǎo)體技術(shù)有限公司市場(chǎng)銷售總監(jiān)ZHOU XinDirector of Sales Marketing, Suzhou Bopai Semiconductor Technology Co., Ltd.

SiC功率器件制造工藝特點(diǎn)與核心裝備創(chuàng)新進(jìn)展Manufacturing process characteristics and key equipment development of SiC power devices鞏小亮中國(guó)電子科技集團(tuán)公司第四十八研究所 半導(dǎo)體裝備研究部副主任GONGXiaoliang Deputy director of Semiconductor equipment research department, the 48th Research Institute of China Electronics Technology Group Corporation