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SiC功率器件制造工藝特點(diǎn)與核心裝備創(chuàng)新進(jìn)展Manufacturing process characteristics and key equipment development of SiC power devices鞏小亮中國電子科技集團(tuán)公司第四十八研究所 半導(dǎo)體裝備研究部副主任GONGXiaoliang Deputy director of Semiconductor equipment research department, the 48th Research Institute of China Electronics Technology Group Corporation

本期嘉賓無錫邑文電子科技有限公司總經(jīng)理廖海濤為大家?guī)怼栋雽?dǎo)體裝備主題報(bào)告（一）半導(dǎo)體二手裝備市場評(píng)估與翻新標(biāo)準(zhǔn)化》