CSP芯片級封裝在Mini-LED背光中的應用進展The Progress of Chip Scale Package in Mini-LED TV Backlighting劉國旭北京易美新創(chuàng)科技有限公司CTO、執(zhí)行副總裁Jay Guoxu LIUCTOExecutive VP of ShineOn Innovation Technology Co., Ltd
MINILED 驅動在TV顯示器背光上的應用廖賢賓華源智信半導體（深圳）有限公司電源事業(yè)部系統(tǒng)應用總監(jiān)LIAO Xianbin System Application Director of Power Supply Division of Huayuan Semiconductor（Shenzhen）Co.,Ltd
背光模組中Mini LED對封裝材料的要求與挑戰(zhàn)Requirements and Challenges for Packaging Materials for Mini LEDs used in Backlight Modules徐建軍北京康美特科技股份有限公司首席技術官Jianjun XUCTO of Beijing KMT Technology Co., Ltd.
